Solid state components not relied upon to reduce the risk of electric shock and that may be damaged by the applied dielectric potential may be disconnected for the test 不可能用來減少電擊風險或有可能被所加的絕緣測試電壓損傷的固態組件可以為測試而斷開連接。
The circuitry may be rearranged for the purpose of the test to reduce the likelihood of solid state component damage while retaining the representative dielectric stress on the circuit 電路上某段出現尖峰電壓時,為了測試,可以將電路重新安排,以減少固態組件受損的可能性。
The circuitry may be rearranged for the purpose of the test to reduce the likelihood of solid state component damage while retaining the representative dielectric stress on the circuit 有獲得的電介質應力集中在電路時,為了測試,可以將電路重新安排,以減少固態組件受損的可能性。
( 2 ) thermal resistance model and cfd are used for thermal design of some air - cooled solid - state module . among these thermal resistances , convective and spreading resistances are emphasized ( 2 )針對某風冷固態組件的散熱需求,利用熱阻模型和流體計算動力學( cfd )數值模擬技術分析和設計了散熱器。
( 4 ) after the rationality of numerical simulation has been testified , going along a series of numerical simulation and performance research . firstly , the thermal superposition principle , based on adiabatic heat transfer coefficient and superposition kernel function , is put forward for the research of discrete heat sources ’ temperature field and thermal conjunction effects secondly , decreasing thermal spreading resistance is good for improving the heat transfer performance , and several methods are discussed 第一、在熱疊加原則理論基礎上,利用數值模擬方法研究了固態組件的溫度場和多個分散熱源在熱擴展體上的熱耦合效應,而且證明了強迫對流情況下熱疊加原理形成的溫度場和系統模擬時的溫度場計算結果非常吻合;第二、針對固態組件里集中熱源的特點,對擴展熱阻進行了研究,從理論上探討了減小擴展熱阻改善散熱性能的方法。
To meet the demand of thermal dispersion of some solid - state module , system research for thermal techniques is carried out , and the main contents are as follows … ( 1 ) the solid - state modules and interrelated thermal techniques are introduced on research background , and moreover developing tendencies of electronics cooling are described 本文對某雷達發射固態組件的熱技術進行了系統的研究,主要內容包括: ( 1 )對固態組件散熱技術的研究背景和意義進行了闡述,對電子散熱技術的現狀和發展趨勢進行了總結。