Measurement and analysis of microtexture in cvd free standing diamond films by ebsd 自支撐金剛石薄膜微區(qū)織構(gòu)的影響分析
Ebsd analysis of local elastic strain fields in semiconductor structures 半導(dǎo)體結(jié)構(gòu)中局域彈性應(yīng)變場的電子背散射衍射分析
Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem , the measurement of texture by xrd and ebsd , the evaluation of barriers by xps and aes 銅互連線的微觀結(jié)構(gòu)的研究:通過afm 、 sem 、 tem等的分析方法對銅膜及銅互連線薄膜的晶粒尺寸進行了評價。
The results show the grain size becomes larger along with elevated temperature and the grain size in interconnects does not change evidently after annealed at 200 ? because of the effect of the trench structure 結(jié)果顯示熱處理后銅膜晶粒長大,但銅互連線薄膜由于溝槽結(jié)構(gòu)對晶粒的長大有阻礙作用。利用xrd和ebsd測試方法對銅膜及銅互連線薄膜的織構(gòu)進行評價。